TMD8N50Z Datasheet | TRinno

Features - Low gate charge - 100% avalanche tested - Improved dv/dt capability - Ro HS pliant - Halogen free package - JEDEC Qualification D-PAK TMD8N50Z(G)/TMU8N50Z(G) BVDSS 500V N-channel MOSFET ID RDS(on) 8A <0.85W I-PAK Device TMD8N50Z/TMU8N50Z TMD8N50ZG/TMU8N50ZG Package D-PAK/I-PAK D-PAK/I-PAK Absolute Maximum Ratings Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current (Note 1) TC = 25 ℃ TC = 100 ℃ Single Pulse Avalanche Energy (Note 2) Repetitive Avalanche Current (Note 1) Repetitive Avalanche Energy (Note 1) Power Dissipation TC = 25 ℃ Derate above 25 ℃ Peak Diode Recovery dv/dt (Note 3) Operating Junction and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8” from case for 5 seconds - Limited only by maximum junction temperature Marking TMD8N50Z/TMU8N50Z TMD8N50ZG/TMU8N50ZG Remark Ro HS Halogen Free Symbol VDSS VGS IDM EAS IAR EAR PD dv/dt TJ, TSTG TMD8N50Z(G)/TMU8N50Z(G) 500 ±30 8.0 4.5 32 554 8 12 120 0.96 4.5 -55~150 Unit V V A A A m J A m J...