DB155G Datasheet | Taiwan Semiconductor

Features UL Recognized File # E-96005 Glass passivated junction Ideal for printed circuit board .. Reliable low cost construction utilizing molded plastic technique High surge current capability High temperature soldering guaranteed: 260℃ / 10 seconds at 5 lbs., ( 2.3 kg ) tension Small size, simple installation Leads solderable per MIL-STD-202 Method 208 .047(1.20) .040(1.02) .205(5.2) .195(5.0) .404(10.3) .386(9.80) .335(8.51) .320(8.13) 45 0 .255(6.5) .245(6.2) .013(0.33) .0088(0.22) .130(3.30) .120(3.05) .060(1.53) .040(1.02) .013(0.33) .003(0.076) Dimensions in inches and (millimeters) Maximum Ratings and Electrical Characteristics Rating at 25℃ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% Type Number Symbol 151G 152G 153G 154G 155G 156G 157G DBS DBS DBS DBS DBS DBS DBS 151G 152G 153G 154G 155G 156G 157G Units Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current @TA = 40℃ Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method ) Maximum Instantaneous Forward Voltage @ 1.5A Maximum DC Reverse Current @ TA=25℃ at Rated DC Blocking Voltage @ TA=125℃ Typical Thermal Resistance (Note) Operating Temperature Range Storage Temperature Range VRRM VRMS VDC I(AV) IFSM VF IR RθJA RθJL TJ 50 35 50 100 70 100 200 140 200 400 280 400 1.5 50 1.1 600 420 600 800 1000 560 700 800 1000 V V V A A V u A u A ℃/w ℃ ℃ TSTG Note: Thermal resistance from Junction to Ambient and from Junction to Lead Mounted on P.C.B. with 0.4” x 0.4” (10mm x 10mm) Copper Pads. 10 500 40 15 -55 to +150 -55 to +150 - 632 - RATINGS AND CHARACTERISTIC CURVES (DB151G THRU DB157G) FIG.1- MAXIMUM DERATING CURVE FOR OUTPUT RECTIFIED CURRENT FIG.2- MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT PER BRIDGE ELEMENT AVERAGE FORWARD...