• Part: TSM8405P
  • Manufacturer: Taiwan Semiconductor Company
  • Size: 206.33 KB
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TSM8405P Description

Bump Side View TSM8405P is new low cost, state of the art MicroSURFTM lateral MOSFET process technology in chip scale bondwireless packaging minimizes PCB space and Rds(on) plus provides an ultra low Qg x Rds(on) figure of merit.