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BAS85 - Hermetically Sealed Glass Fast Switching Schottky Barrier Diodes

General Description

DIM.

DIM.

Typ.

Key Features

  • - Low forward voltage drop - Ideal for automated placement - Hermetically sealed glass - Compression bonded construction - All external surfaces are corrosion resistant and leads are readily solderable - Solder hot dip tin (Sn) lead finish MINI MELF.

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Datasheet Details

Part number BAS85
Manufacturer Taiwan Semiconductor
File Size 183.15 KB
Description Hermetically Sealed Glass Fast Switching Schottky Barrier Diodes
Datasheet download datasheet BAS85 Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Small Signal Product CREAT BY ART BAS85 Taiwan Semiconductor Hermetically Sealed Glass Fast Switching Schottky Barrier Diodes FEATURES - Low forward voltage drop - Ideal for automated placement - Hermetically sealed glass - Compression bonded construction - All external surfaces are corrosion resistant and leads are readily solderable - Solder hot dip tin (Sn) lead finish MINI MELF MECHANICAL DATA - Polarity: Indicated by black cathode band MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) PARAMETER SYMBOL VALUE Power Dissipation PD 200 Repetitive Peak Reverse Voltage VRRM 30 Maximum DC Blocking Voltage VR 30 Average Forward Rectified Current IF(AV) 200 Peak Forward Surge Current IFSM 4 Operating Junction Temperature TJ 125 Storage Tem