BC817-25W
FEATURES
- Epitaxial planar die construction
- Surface mount device type
- Moisture sensitivity level 1
- Matte Tin(Sn) lead finish with Nickel(Ni) underplate
- Pb free and Ro HS plian
- Green pound (Halogen free) with suffix "G" on packing code and prefix "G" on date code
MECHANICAL DATA
- Case: SOT- 323 small outline plastic package
- Terminal: Matte tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed
- High temperature soldering guaranteed: 260°C/10s
- Weight: 0.005 grams (approximately)
SOT-323
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted)
PARAMETER
SYMBOL
VALUE
Power Dissipation Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Thermal Resistance, Junction to Ambient Junction and Storage Temperature Range Notes: 1. Transistor mounted on a FR4 printed-circuit board
PD VCBO VCEO VEBO
IC RθJA TJ , TSTG
200 50 45 5 0.5 625 -55 to + 150
UNIT m W V V V A
K/W °C
PARAMETER
SYMBOL
Collect...
