BC848B Datasheet | Taiwan Semiconductor

FEATURES - Epitaxial planar die construction - Surface mount device type - Moisture sensitivity level 1 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Pb free and Ro HS plian - Green pound (Halogen free) with suffix "G" on packing code and prefix "G" on date code MECHANICAL DATA - Case: SOT- 23 small outline plastic package - Terminal: Matte tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed: 260°C/10s - Weight: 0.008gram (approximately) SOT-23 MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) PARAMETER SYMBOL VALUE Power dissipation BC846 Collector-Base Voltage BC847 BC848 BC846 Collector-Emitter Voltage BC847 BC848 BC846 Emitter-Base Voltage BC847 BC848 Collector Current Junction and Storage Temperature Range Notes: 1. Valid provided that electrodes are kept at ambient temperature PD VCBO VCEO VEBO IC TJ , TSTG 200 80 50 30 65 45 30 6 6 5 0.1 -55 to + 150 UNIT m...