HS2F
Features
Glass passivated junction chip. For surface mounted application Low forward voltage drop Low profile package Built-in stain relief, ideal for automatic placement Fast switching for high efficiency High temperature soldering: o 260 C/10 seconds at terminals Plastic material used carries Underwriters Laboratory Classification 94V0
.187(4.75) .167(4.25) .012(.31) .006(.15)
.103(2.61) .078(1.99) .012(.31) .006(.15) .056(1.41) .035(0.90) .209(5.30) .201(5.10) .008(.20) .004(.10)
Mechanical Data
Cases: Molded plastic Terminals: Pure tin plated, lead free Polarity: Indicated by cathode band Packing: 12mm tape per EIA STD RS-481 Weight: 0.093 gram
.Data Sheet.co.kr
Dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characteristics
Rating at 25 o C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%
Type Number
Maximum Recurrent Peak Reverse Voltage Maximum RMS...
