Download MBD4448HADW Datasheet PDF
Taiwan Semiconductor
MBD4448HADW
FEATURES - Fast switching speed - Surface device type mounting - Moisture sensitivity level 1 - High conductance power dissipation - For general purpose switching applications - Pb free version and Ro HS pliant - Packing code with suffix "G" means green pound (halogen-free) MECHANICAL DATA - Case: SOT-363 small outline plastic package - Terminal: Matte tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed : 260°C/10s SOT-363 MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER SYMBOL VALUE Power Dissipation PD 200 Repetitive Peak Reverse Voltage Reverse Voltage VRRM VR 80 57 Average Rectified Forward Current IF(AV) Average Rectified Output Current IO 250 Non-Repetitive Peak Forward Surge Current @ t = 1 μs @t=1s IFSM 4 1.5 Thermal Resistance (Junction to Ambient) RθJA Junction and Storage Temperature Range TJ , TSTG -55 to 150 PARAMETER Reverse Breakdown...