Download TSM35N10CP Datasheet PDF
Taiwan Semiconductor
TSM35N10CP
Features - - - - Advanced Trench Technology Low RDS(ON) 37mΩ (Max.) Low gate charge typical @ 34n C (Typ.) Low Crss typical @ 45p F (Typ.) Block Diagram Ordering Information Part No. TSM35N10CP ROG Package TO-252 Packing 2.5Kpcs / 13” Reel Note: “G” denote for Halogen Free Product N-Channel MOSFET Absolute Maximum Rating (Ta = 25o C unless otherwise noted) Parameter Drain-Source Voltage Gate-Source Voltage TC=25° C TC=70° C TA=25° C TA=70° C Symbol VDS VGS Limit 100 ±20 32 26 5 4 70 35 61 83.3 53.3 2 1.3 -55 to +150 -55 to +150 Unit Continuous Drain Current Drain Current-Pulsed Note 1 Avalanche Current, L=0.1m H Avalanche Energy, L=0.1m H TC=25° C Maximum Power Dissipation TC=70° C TA=25° C TA=70° C IDM IAS, IAR EAS, EAR A A m J Storage Temperature Range Operating Junction Temperature Range - Limited by maximum junction temperature TSTG TJ ° C ° C Thermal Performance Parameter Thermal Resistance - Junction to Case Thermal Resistance - Junction to...