• Part: TC358764XBG
  • Description: Mobile Peripheral
  • Manufacturer: Toshiba
  • Size: 491.35 KB
Download TC358764XBG Datasheet PDF
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Datasheet Summary

TC358764XBG/TC358765XBG CMOS Digital Integrated Circuit Silicon Monolithic TC358764XBG/TC358765XBG Mobile Peripheral Devices Overview The primary function of TC358764XBG/TC358765XBG is DSI-to-LVDS Bridge, enabling video streaming output over DSI link to drive LVDS-patible display panels. The chip supports up to 1366×768 24-bit pixel resolution for single-link LVDS and up to WUXGA (1920x1200 18-bit pixels) resolution for dual-link LVDS. As a secondary function, the chip also supports an I2C Master which is controlled by the DSI link; this may be used as an interface to any other control functions through I2C. The chip can be configured through the DSI link by sending...