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MA4SPS552 - Surface Mount Monolithic PIN Diode Chip

General Description

This device is a silicon-glass PIN diode chip fabricated with M/A-COM’s patented HMIC process.

Key Features

  • n n n n n n n V 1.00 MA4SPS552 Case Style ODS-1281 A Surface Mount Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Power Handling (Efficient Heatsinking) B.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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www.DataSheet4U.com Surface Mount Monolithic PIN Diode Chip Features n n n n n n n V 1.00 MA4SPS552 Case Style ODS-1281 A Surface Mount Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Power Handling (Efficient Heatsinking) B Description This device is a silicon-glass PIN diode chip fabricated with M/A-COM’s patented HMIC process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conductive. Selective backside metalization is applied producing a surface mount device.