MA4SPS552 Datasheet | Tyco Electronics

.. Surface Mount Monolithic PIN Diode Chip Features n n n n n n n V 1.00 Case Style ODS-1281 Surface Mount Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Power Handling (Efficient Heatsinking) Description This device is a silicon-glass PIN diode chip fabricated with M/A-’s patented HMIC process. This device Features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conductive. Selective...