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MA4SPS552 - Surface Mount Monolithic PIN Diode Chip

Datasheet Summary

Description

This device is a silicon-glass PIN diode chip fabricated with M/A-COM’s patented HMIC process.

Features

  • n n n n n n n V 1.00 MA4SPS552 Case Style ODS-1281 A Surface Mount Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Power Handling (Efficient Heatsinking) B.

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Datasheet Details

Part number MA4SPS552
Manufacturer Tyco Electronics
File Size 181.51 KB
Description Surface Mount Monolithic PIN Diode Chip
Datasheet download datasheet MA4SPS552 Datasheet
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www.DataSheet4U.com Surface Mount Monolithic PIN Diode Chip Features n n n n n n n V 1.00 MA4SPS552 Case Style ODS-1281 A Surface Mount Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Power Handling (Efficient Heatsinking) B Description This device is a silicon-glass PIN diode chip fabricated with M/A-COM’s patented HMIC process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conductive. Selective backside metalization is applied producing a surface mount device.
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