SW-461 Datasheet | Tyco Electronics

.. 4x6 RF Switch Matrix 800 - 900 MHz Features - - - - - High Isolation: 40 d B Low Current draw: < 2m A @ +5 V < 10m A @ -5V 5V CMOS Logic 45mm PBGA Package JEDEC MO-151 Foot Print PBGA Package Outline Description M/A-’s SW-461 is a multi-chip module containing six SP4T Ga As switches, each with a driver/decoder and four Ga As 6-way power dividers. The SW-461 utilizes Plastic Ball Grid Array (PBGA) interconnect technology to achieve high circuit density and superior high frequency performance. This device is ideal for telephony applications in the AMPS frequency bands. The SW-461 is constructed with a multi layer PCB using a ball grid array for the I/O connects. The bination of several state-of-the-art technologies achieves high performance at a low cost. Ordering Information Part Number SW-461 Package 45mm PBGA Package Electrical Specifications: TA = +25°C1, Control Voltage = +5.0V= Parameter Insertion Loss VSWR Isolation Balance P1d B 1. Test Conditions 800 - 900 MHz 800 - 900 MHz 800 - 900 MHz 800 - 900 MHz 800 - 900 MHz Units d B d B d B d Bm Min. Typ. -11.5 1.5:1 57 0.7 33 Max. -12 1.9:1 1.2 All measurements in a 50Ω system. Specifications subject to change without notice. V2.00 V 2.0 North America: Tel. (800) 366-2266, Fax (800) 618-8883 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 Visit .ma. for additional data sheets and product...