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VM50-850-C12 - VCSEL

Download the VM50-850-C12 datasheet PDF. This datasheet also covers the VM50-850-C1 variant, as both devices belong to the same vcsel family and are provided as variant models within a single manufacturer datasheet.

Description

These compact and very high modulation rate top-emitting GaAs-based vertical cavity surface emitting laser (VCSEL) chips and 1xN (N=4,12) arrays are available as engineering samples for use in the development and evaluation of optical interconnections, optical backplanes and integrated waveguides, a

Features

  • 4-ch or 12 chip arrays.
  • Up to 56 Gbit/s per channel.
  • Device-to-device pitch of 250 µm.
  • Suitable for wire or flip-chip bonding.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (VM50-850-C1-VIS.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number VM50-850-C12
Manufacturer VIS
File Size 871.60 KB
Description VCSEL
Datasheet download datasheet VM50-850-C12 Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer

Other Datasheets by VIS

Part Number Description
VM50-850-C1 VCSEL
VM50-850-C4 VCSEL
VM50-940-GSG-C1 VCSEL

Full PDF Text Transcription

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Datasheet VM50-850-Cxx 56 Gbit/s VCSEL (850 nm) Contact type: GS/SG Product Code: VM50-850-C1 VM50-850-C4 VM50-850-C12 1x1 4x1 12x1 Sample image only. Actual product may vary. Product Description These compact and very high modulation rate top-emitting GaAs-based vertical cavity surface emitting laser (VCSEL) chips and 1xN (N=4,12) arrays are available as engineering samples for use in the development and evaluation of optical interconnections, optical backplanes and integrated waveguides, and next-generation optical data communications systems. The VCSELs are contacted on the top-surface individually using ground-source (GS) microprobes, wire bonds, or flip-chip bonds.
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