VM50-850-C1
Description
These pact and very high modulation rate top-emitting Ga As-based vertical cavity surface emitting laser (VCSEL) chips and 1x N (N=4,12) arrays are available as engineering samples for use in the development and evaluation of optical interconnections, optical backplanes and integrated waveguides, and next-generation optical data munications systems. The VCSELs are contacted on the top-surface individually using ground-source (GS) microprobes, wire bonds, or flip-chip bonds.
Optical aperture: ~5-7µm
Features
- 4-ch or 12 chip arrays
- Up to 56 Gbit/s per channel
- Device-to-device pitch of 250 µm
- Suitable for wire or flip-chip bonding
Applications
- Ethernet
- Proprietary optical interconnects
- Active Optical Cables (AOC)
- Short-reach 56G and 100G Ethernet
Parameter Emission wavelength Data rate Threshold current Peak output power
Typical 850 nm ~56 Gbit/s ~ 0.5 m A ~3 m W @85°C
Notes PAM-4
All product specifications and descriptions are subject to change without...
