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VM50-850-C4 Datasheet VCSEL

Manufacturer: VIS

Overview: Datasheet VM50-850-Cxx 56 Gbit/s VCSEL (850 nm) Contact type: GS/SG Product Code: VM50-850-C1 VM50-850-C4 VM50-850-C12 1x1 4x1 12x1 Sample image only. Actual product may vary.

Download the VM50-850-C4 datasheet PDF. This datasheet also includes the VM50-850-C1 variant, as both parts are published together in a single manufacturer document.

General Description

These compact and very high modulation rate top-emitting GaAs-based vertical cavity surface emitting laser (VCSEL) chips and 1xN (N=4,12) arrays are available as engineering samples for use in the development and evaluation of optical interconnections, optical backplanes and integrated waveguides, and next-generation optical data communications systems.

The VCSELs are contacted on the top-surface individually using ground-source (GS) microprobes, wire bonds, or flip-chip bonds.

Optical aperture: ~5-7µm

Key Features

  • 4-ch or 12 chip arrays.
  • Up to 56 Gbit/s per channel.
  • Device-to-device pitch of 250 µm.
  • Suitable for wire or flip-chip bonding.