BU2008 Overview
Key Specifications
Package: SIP
Mount Type: Through Hole
Pins: 4
Height: 18.8 mm
Key Features
- UL recognition file number E309391 (QQQX2) UL 1557 (see *)
- Thin single in-line package
- Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU20065S)
- Superior thermal conductivity
- Solder dip 275 °C max. 10 s, per JESD 22-B106
