BU2008-E3 Overview
BU2006-E3, BU2008-E3, BU2010-E3 Vishay General Semiconductor Enhanced isoCink+™ Bridge Rectifiers + ~~ isoCink+™ Case Style BU - ~~+ +~~ - Tested to UL standard for safety electrically isolated semiconductor devices. UL 1557 4th edition. Dielectric tested to maximum case, storage and junction temperature to 150 °C to withstand 1500 V. Epoxy meets UL 94 V-0 flammability rating. PRIMARY CHARACTERISTICS Package BU...
BU2008-E3 Key Features
- UL recognition file number E309391 (QQQX2)
- Thin single in-line package
- Available for BU-5S lead forming option
- Superior thermal conductivity
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- Material categorization: For definitions of pliance