Datasheet Details
| Part number | FCSP0530ETR |
|---|---|
| Manufacturer | Vishay |
| File Size | 119.19 KB |
| Description | chip scale packaging to deliver Schottky diodes |
| Datasheet |
 FCSP0530ETR Datasheet
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General Description
FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in the industry.
The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space.
Key Features
- Ultralow VF to footprint area Very low profile (< 0.6 mm ) Low thermal resistance Supplied tested and on tape and reel Designed for consumer level.