FCSP130TR
FCSP130TR is Chip Scale Package Schottky Barrier Rectifier manufactured by Vishay.
Vishay High Power Products
Flip KY®, 1.0 A
Features
- Ultra low VF per footprint area
- Low thermal resistance
- One-fifth footprint of SMA
- Super low profile (< 0.7 mm)
- Available tested on tape and reel
- Small footprint, surface mountable
Flip KY®
Ro HS
PLIANT
- Low forward voltage drop
- High frequency operation
- Guard ring for enhanced ruggedness and long term reliability
- Lead (Pb)-free
- Designed for consumer level
DESCRIPTION
True chip-scale packaging is available from Vishay HPP. The FCSP130TR surface mount Schottky rectifier has been designed for applications requiring low forward drop and very small footprints on PC boards. Typical applications are in disk drives, switching power supplies, converters, freewheeling diodes, battery charging, and reverse battery protection. The Flip KY® package, is one-fifth the footprint of a parable SMA package and has a profile of less then 0.7 mm. bined with the low thermal resistance of the die level device, this makes the Flip KY the best device for application where printed circuit board space is at a premium and in extremely thin application environments such as battery packs, cell phones and PCMCIA cards.
PRODUCT SUMMARY
IF(AV) VR 1.0 A 30 V
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MAJOR RATINGS AND CHARACTERISTICS
SYMBOL IF(AV) VRRM IFSM VF TJ tp = 5 µs sine 1.0 Apk, TJ = 125 °C Range CHARACTERISTICS Rectangular waveform VALUES 1.0 30 220 0.33
- 55 to 150 UNITS A V A V °C
VOLTAGE RATINGS
PARAMETER Maximum DC reverse voltage Maximum working peak reverse voltage SYMBOL VR VRWM FCSP130TR 30 UNITS V
Document Number: 94278 Revision: 02-Jul-08
For technical questions, contact: diodes-tech@vishay.
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