Datasheet Details
| Part number | FCSP140LTR |
|---|---|
| Manufacturer | Vishay |
| File Size | 142.61 KB |
| Description | Chip Scale Package Schottky Barrier Rectifier |
| Datasheet |
 FCSP140LTR Datasheet
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General Description
Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry.
The four bump 1.5 x 1.5 mm devices can deliver up to 1 A and occupy only 2.3 mm2 of board space.
Key Features
- Ultra low VF per footprint area.
- Low leakage.
- Low thermal resistance.
- One-fifth footprint of SMA.
- Super low profile (0.6 mm).
- Available tested on tape and reel RoHS.