IHLP2525BD-01 Datasheet | Vishay

FEATURES - Lowest height (2.4 mm) in this package footprint - Shielded construction - Frequency range up to 5.0 MHz - Lowest DCR/µH, in this package size Manufactured under one or more of the following: US Patents; 6,198,375/6,204,744/6,449,829/6,460,244. Several foreign patents, and other patents pending. Ro HS PLIANT - Handles high transient current spikes without saturation - Ultra low buzz noise, due to posite construction - 100 % lead (Pb)-free and Ro HS pliant APPLICATIONS STANDARD ELECTRICAL SPECIFICATIONS Lo INDUCTANCE µH ± 20 % at 100 k Hz, 0.25 V, 0A 0.1 0.22 0.33 0.47 0.68 0.82 1.0 1.5 2.2 3.3 4.7 6.8 8.2 HEAT RATING SATURATION CURRENT CURRENT DCR mΩ DCR mΩ DC AMPS3 DC AMPS4 TYPICAL MAX TYPICAL TYPICAL 25 °C 25 °C 1.5 2.9 3.7 6 8.7 10.6 13.1 18.5 28 36.5 45.2 72.5 84.2 1.7 3.2 4.1 6.5 9.4 11.8 14.2 21.2 34 51.6 63 95 106 30 21 18 13.5 11 10 9.0 7.5 6.5 5.0 4.5 3.5 3.0 50 34 22 21 18 17 16 15 14 13 10 9 8 0.270 ± 0.015 [6.86 ± 0.381] 0.255 ± 0.010 [6.47 ± 0.254] 0.125 ± 0.01 [3.18 ± 0.3] 0.146 [3.71] 0.290 [7.37] Typical Pad Layout (Min.) 0.135 [3.43] - PDA/Notebook/Desktop/Server applications - High current POL converters - Low profile, high current power supplies - Battery powered devices - DC/DC converters in distributed power systems - DC/DC converter for Field Programmable Gate Array (FPGA) DIMENSIONS in inches [millimeters] 10 115.6 129 2.5 7 NOTES: 1. All test data is referenced to 25 °C ambient 2. Operating Temperature Range - 55 °C to + 125 °C 3. DC current (A) that will cause an approximate ΔT of 40 °C 4. DC current (A) that will cause Lo to drop approximately 20 % 5. The part temperature (ambient + temp rise) should not exceed 125 °C under worst case operating conditions. Circuit design, ponent placement, PWB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 0.095 [2.4] Max. 0.050 ± 0.012 [1.27 ± 0.30] DESCRIPTION IHLP-2525BD-01 MODEL...