SE10PB Overview
Key Features
- Very low profile
- typical height of 1.0 mm
- Ideal for automated placement
- Oxide planar chip junction
- Low forward voltage drop
- Typical IR less than 0.1 μA
- ESD capability
- Meets MSL level 1, per LF maximum peak of 260 °C
- Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC
