SE15PB Description
175 °C Package SMP (DO-220AA) Circuit configuration Single.
SE15PB Key Features
- Very low profile
- typical height of 1.0 mm
- Ideal for automated placement
- Oxide planar chip junction
- Low forward voltage drop
- Typical IR less than 0.1 μA
- ESD capability
- Meets MSL level 1, per J-STD-020, LF maximum peak
- AEC-Q101 qualified
- Material categorization: for definitions of pliance