SE15FG Overview
Key Features
- Low profile package Available
- Ideal for automated placement
- Oxide planar chip junction
- Low forward voltage drop, low leakage current
- ESD capability
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- Wave and reflow solderable
- AEC-Q101 qualified available
- Automotive ordering code: base P/NHM3
- Material categorization: for definitions of compliance please see MECHANICAL DATA Case: DO-219AB (SMF) Molding compound meets UL 94
