SL02
Overview
- For surface mounted applications
- Ideal for automated placement
- Low power loss, high efficiency
- Oxide planar chip junction
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- Meets JESD 201 class 2 whisker test
- Wave and reflow solderable
- AEC-Q101 qualified
- Compatible to SOD-123W package case outline or
