TFDU5103
TFDU5103 is Fast Infrared Transceiver Module manufactured by Vishay.
VISHAY
Vishay Semiconductors
Fast Infrared Transceiver Module (MIR, 1.152 Mbit/s) for 2.7 V to 5.5 V Operation
Description
The TFDU5103 is a low-power infrared transceiver module pliant to the latest Ir DA physical layer standard for fast infrared data munication, supporting Ir DA speeds up to 1.152 Mbit/s (MIR), and carrier based remote control modes up to 2 MHz. The transceiver module consists of a PIN photodiode, an infrared emitter (IRED), and a low-power CMOS control IC to provide a total front-end solution in a single package.
Vishay MIR transceivers are available in different package options, including this Baby Face package (TFDU5103). This wide selection provides flexibility for a variety of applications and space constraints. The transceivers are capable of directly interfacing with a wide variety of I/O devices which perform the modulation/ demodulation function, including National Semiconductor’s PC87338, PC87108 and PC87109, SMC’s FDC37C669, FDC37N769 and CAM35C44, and Hitachi’s SH3. At a minimum, a VCC bypass capacitor is the only external ponent required implementing a plete solution. TFDU5103 has a tri-state output and is floating in shutdown mode with a weak pull-up.
Features
- Supply voltage 2.7 V to 5.5 V, Operating idle current (receive mode) < 3 m A, Shutdown current < 5 µA over full temperature range
- Surface Mount Package, top and side view, L 9.7 mm x W 4.7 mm x H 4.0 mm
- Operating Temperature
- 25 °C to 85 °C
- Storage Temperature
- 40 °C to 100 °C
- Transmitter Wavelength typ. 886 nm, supporting Ir DA® and Remote Control
- Ir DA® pliant, link distance (MIR) > 1 m, ± 15 °, window losses are allowed to still be inside the Ir DA® spec.
- Remote Control Range > 8 m, 22 m
- ESD > 4000 V (HBM), Latchup > 200 m A
- EMI immunity > 550 V/m for GSM frequency and other mobile telephone bands / (700 MHz to 2000 MHz, no external shield)
- Split power supply, LED can be driven by a separate power supply not loading the...