Description
TSMF1000 series are infrared, 890 nm emitting diodes based on surface emitter chip technology with high radiant power and high speed, molded in clear, untinted plastic packages (with lens) for surface mounting (SMD).
Features
- Package type: surface-mount.
- Package form: GW, RGW, yoke.
- Dimensions (L x W x H in mm): 2.5 x 2 x 2.7.
- Peak wavelength: λp = 890 nm.
- High radiant power.
- Angle of half intensity: ϕ = ± 11°.
- Low forward voltage.
- Suitable for high pulse current operation.
- Package matches with detector TEMD1000.
- Floor life: 168 h, MSL 3, according to J-STD-020.
- Material categorization: for definitions of compliance
pl.
TSMF1000 Datasheet
