UGF15JT
FEATURES
- Glass passivated chip junction
- Ultrafast recovery times
- Soft recovery charateristics
- Low switching losses, high efficiency
2 UG15x T
PIN 1
PIN 2
2 1 UGF15x T
PIN 1
- High forward surge capability
- Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package)
- Solder dip 260 °C, 40 s (for TO-220AC and ITO-220AC package)
- ponent in accordance to Ro HS 2002/95/EC and WEEE 2002/96/EC
CASE
PIN 2
TO-263AB K
2 1 UGB15x T
PIN 1 PIN 2
K HEATSINK
TYPICAL APPLICATIONS For use in high voltage, high frequency power factor correctors, switching mode power supplies, freewheeling diodes and secondary dc-to-dc rectification application. MECHANICAL DATA Case: TO-220AC, ITO-220AC, TO-263AB Epoxy meets UL 94V-0 flammability rating Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD22-B102 E3 suffix for consumer grade, meets JESD 201 class 1A whisker test, HE3 suffix for high reliability grade (AEC-Q101 qualified), meets JESD 201 class 2...
