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UGF18CCT - Dual Common-Cathode Ultrafast Plastic Rectifier

Download the UGF18CCT datasheet PDF. This datasheet also covers the UGF18ACT variant, as both devices belong to the same dual common-cathode ultrafast plastic rectifier family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • Glass passivated chip junction.
  • Ultrafast recovery time.
  • Low switching losses, high efficiency.
  • Low forward voltage drop 3 2 UG18xCT Series PIN 1 PIN 3 PIN 2 CASE 3 1 UGF18xCT Series PIN 1 PIN 3 PIN 2 2.
  • High forward surge capability.
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package).
  • Solder dip 260 °C, 40 s (for TO-220AB and ITO-220AB package).
  • Component in accordance to RoHS 2002/95/EC.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (UGF18ACT_VishaySiliconix.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number UGF18CCT
Manufacturer Vishay
File Size 190.32 KB
Description Dual Common-Cathode Ultrafast Plastic Rectifier
Datasheet download datasheet UGF18CCT Datasheet

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Other Datasheets by Vishay

Part Number Description
UGF18ACT Dual Common-Cathode Ultrafast Plastic Rectifier
UGF18BCT Dual Common-Cathode Ultrafast Plastic Rectifier
UGF18DCT Dual Common-Cathode Ultrafast Plastic Rectifier
UGF10DCT Dual Ultrafast Soft Recovery Rectifiers
UGF12HT Ultrafast Rectifiers

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
UG(F,B)18ACT thru UG(F,B)18DCT Vishay General Semiconductor Dual Common-Cathode Ultrafast Plastic Rectifier TO-220AB ITO-220AB FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop 3 2 UG18xCT Series PIN 1 PIN 3 PIN 2 CASE 3 1 UGF18xCT Series PIN 1 PIN 3 PIN 2 2 • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 s (for TO-220AB and ITO-220AB package) • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC 1 TO-263AB K 2 1 UGB18xCT Series PIN 1 PIN 2 K HEATSINK TYPICAL APPLICATIONS For use in high frequency rectifier of switching mode power supplies, inverters, freewheeling diodes, dc-to-dc converters, a