UGF8HT
FEATURES
- Glass passivated chip junction
- Ultrafast recovery time
- Soft recovery characteristics
- Low switching losses, high efficiency
2 UG8x T
PIN 1
PIN 2
2 1 UGF8x T
PIN 1
- High forward surge capability
- Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package)
- Solder dip 260 °C, 40 s (for TO-220AC and ITO-220AC package)
- ponent in accordance to Ro HS 2002/95/EC and WEEE 2002/96/EC
CASE
PIN 2
TO-263AB K
2 1 UGB8x T
PIN 1 PIN 2 K HEATSINK
TYPICAL APPLICATIONS For use in high voltage and high frequency power factor correction application. MECHANICAL DATA
PRIMARY CHARACTERISTICS
IF(AV) VRRM IFSM trr tfr VF .. TJ max. 8A 500 V, 600 V 100 A 25 ns 500 ns 1.5 V 150 °C
Case: TO-220AC, ITO-220AC, TO-263AB Epoxy meets UL 94V-0 flammability rating Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD22-B102 E3 suffix for consumer grade, meets JESD 201 class 1A whisker test, HE3 suffix for high reliability grade (AEC Q101 qualified),...
