FEP30JP-E3 Datasheet | Vishay

FEATURES - Power pack - Glass passivated pellet chip junction - Ultrafast recovery time - Low switching losses, high efficiency - Low thermal resistance - High forward surge capability - Solder dip 260 °C, 40 s - Material categorization: for definitions of pliance please see .vishay./doc?99912 PRIMARY CHARACTERISTICS IF(AV) VRRM 30 A 50 V, 100 V, 150 V, 200 V, 300 V, 400 V, 500 V, 600 V IFSM trr VF at IF = 15 A TJ max. Package 300 A 35 ns, 50 ns 0.95 V, 1.3 V, 1.5 V 150 °C TO-3P (TO-247AD) Circuit configuration mon cathode TYPICAL APPLICATIONS For use in high frequency rectifier of switching mode power supplies, inverters, freewheeling diodes, DC/DC converters, and other power switching application. MECHANICAL DATA Case: TO-3P (TO-247AD) Molding pound meets UL 94 V-0 flammability rating Base P/N-E3 - Ro HS-pliant, mercial grade Terminals: matte tin plated leads, solderable per J-STD-002 and JESD22-B102 E3 suffix meets JESD 201 class 1A whisker test Polarity: as marked Mounting Torque: 10 in-lbs max. MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL FEP 30AP FEP 30BP Maximum repetitive peak reverse voltage VRRM 50 100 Maximum RMS voltage VRMS Maximum DC blocking voltage Maximum average forward rectified current at TC = 100 °C Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load per diode VDC IF(AV) IFSM 50 100 Operating storage and temperature range TJ,...