FEP30JP-E3 Overview
Key Specifications
Mount Type: Through Hole
Pins: 3
Max Operating Temp: 150 °C
Min Operating Temp: -55 °C
Key Features
- Glass passivated pellet chip junction
- Ultrafast recovery time
- Low switching losses, high efficiency
- Low - High forward surge capability
- Solder dip 260 °C, 40 s