FESB8AT
Overview
- Power pack
- Glass passivated pellet chip junction
- Ultrafast recovery time
- Low switching losses, high efficiency
- Low leakage current
- High forward surge capability
- Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package)
- Solder dip 275 °C max., 10 s per JESD 22-B106 (for TO-220AC and ITO-220AC package)
- AEC-Q101 qualified
- Material categorization: for definitions of compliance please see
