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FGP30C - Glass Passivated Ultrafast Rectifier

Download the FGP30C datasheet PDF. This datasheet also covers the FGP30B variant, as both devices belong to the same glass passivated ultrafast rectifier family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • Superectifier structure for high reliability condition.
  • Cavity-free glass-passivated junction.
  • Ideal for automated placement.
  • Ultrafast reverse recovery time.
  • Low switching losses, high efficiency.
  • High forward surge capability.
  • Meets environmental standard MIL-S-19500.
  • Solder dip 275 °C max. 10 s, per JESD 22-B106.
  • AEC-Q101 qualified.
  • Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/9.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (FGP30B-Vishay.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number FGP30C
Manufacturer Vishay
File Size 74.09 KB
Description Glass Passivated Ultrafast Rectifier
Datasheet download datasheet FGP30C Datasheet

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Other Datasheets by Vishay

Part Number Description
FGP30B Glass Passivated Ultrafast Rectifier
FGP30D Glass Passivated Ultrafast Rectifier
FGP50B Glass Passivated Ultrafast Plastic Rectifier
FGP50C Glass Passivated Ultrafast Plastic Rectifier
FGP50D Glass Passivated Ultrafast Plastic Rectifier

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
New Product FGP30B thru FGP30D Vishay General Semiconductor Glass Passivated Ultrafast Rectifier SUPERECTIFIER® DO-204AC (DO-15) PRIMARY CHARACTERISTICS IF(AV) 3.0 A VRRM 100 V to 200 V IFSM 125 A trr 35 ns VF 0.95 V IR 5.0 μA TJ max. 175 °C FEATURES • Superectifier structure for high reliability condition • Cavity-free glass-passivated junction • Ideal for automated placement • Ultrafast reverse recovery time • Low switching losses, high efficiency • High forward surge capability • Meets environmental standard MIL-S-19500 • Solder dip 275 °C max.