IRF730S Overview
Description
Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2PAK (TO-263) is a surface-mount power package capable of accommodating die size up to HEX-4.
Key Features
- Surface-mount
- Available in tape and reel
- Dynamic dV/dt rating Available
- Repetitive avalanche rated
- Fast switching Available
- Ease of paralleling
- Simple drive requirements
