MBR1090
Overview
- Trench MOS Schottky technology
- Lower power losses, high efficiency
- Low forward voltage drop
- High forward surge capability
- High frequency operation
- Meets MSL level 1, per J-STD-020C, LF max peak of 245 °C (for TO-263AB package)
- Solder dip 260 °C, 40 seconds (for TO-220AC and ITO-220AC package)
- Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
