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www.vishay.com
RCP
Vishay Dale
Thick Film Chip Resistors, Industrial, High Power, Aluminum Nitride Substrate
Aluminum nitride over 3 x more power - same size
LINKS TO ADDITIONAL RESOURCES
S-Parameters
MATERIAL SPECIFICATIONS
Resistive element
Ruthenium oxide
Encapsulation
Epoxy
Substrate
Aluminum nitride
Termination
Solder-coated nickel barrier
Solder finish
Pure tin or tin / lead solder alloy
FEATURES
• Thick film resistive element on an aluminum nitride (AlN) substrates
Available
• Very high thermal conductivity in a small package size
• Termination: tin / lead wraparound termination over nickel barrier.