THJP0805 - Thermal Jumper Surface-Mount Chip

This page provides the datasheet information for the THJP0805, a member of the THJP0603 Thermal Jumper Surface-Mount Chip family.

Features

Electrically isolated thermal conductor.
High thermal conductivity AlN substrate (170 W/mK).
Electrically isolated terminations (> 999 MΩ) Available Available.
Low capacitance.
Available with SnPb or lead (Pb)-free wrap terminations Available.
AEC-Q200 qualified.
Material categorization: for definitions of compliance please see www. vishay. com/doc?99912.

Vishay

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Datasheet Details

Part number	THJP0805
Manufacturer	Vishay
File Size	163.75 KB
Description	Thermal Jumper Surface-Mount Chip
Datasheet	THJP0805 Datasheet
Additional preview pages of the THJP0805 datasheet.

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Full PDF Text Transcription

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www.vishay.com THJP Vishay Dale Thin Film ThermaWick® Thermal Jumper Surface Mount Chip LINKS TO ADDITIONAL RESOURCES 3D 3D 3D Models Product Page Infographics Videos Packages Footprints THJP surface-mount chips are designed to provide an electrically isolated thermal conductive pathway to a ground plane or heat sink while maintaining the electrical isolation of the device. The devices are constructed with aluminum nitride substrates in both SnPb and Pb-free wraparound termination styles. The low capacitance of the device makes them an excellent choice for high frequency and thermal ladder applications. Custom sizes available.

Published: Aug 22, 2021 |