THJP2512 Overview
THJP Vishay Dale Thin Film ThermaWick® Thermal Jumper Surface Mount Chip LINKS TO ADDITIONAL RESOURCES 3D 3D 3D Models Product Page Infographics Videos Packages Footprints THJP surface-mount chips are designed to provide an electrically isolated thermal conductive pathway to a ground plane or heat sink while maintaining the electrical isolation of the device. The devices are constructed with aluminum nitride...
THJP2512 Key Features
- Electrically isolated thermal conductor
- High thermal conductivity AlN substrate (170 W/mK)
- Electrically isolated terminations (> 999 MΩ)
- Low capacitance
- Available with SnPb or lead (Pb)-free wrap terminations
- AEC-Q200 qualified
- Material categorization: for definitions of pliance please see .vishay./doc?99912