V3PAN50 Overview
V3PAN50 Vishay General Semiconductor Surface Mount Trench MOS Barrier Schottky Rectifier TMBS® SMPATM Top View Bottom View DO-221BC (SMPA) PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM VF at IF = 3.0 A (TA = 125 °C) TJ max. Package 3.0 A 50 V 80 A 0.40 V 150 °C DO-221BC (SMPA) Diode variation Single die.
V3PAN50 Key Features
- Very low profile
- typical height of 0.95 mm
- Ideal for automated placement
- Trench MOS Schottky technology
- Low power losses, high efficiency
- Low forward voltage drop
- Meets MSL level 1, per J-STD-020, LF maximum peak
- Material categorization: For definitions of pliance
V3PAN50 Applications
- halogen-free, RoHS-pliant, and mercial grade Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD22-B102 M3 suffix meets JESD 201 class 2 whisk