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V8PAL50 - Surface Mount Trench MOS Barrier Schottky Rectifier

Key Features

  • Very low profile - typical height of 0.95 mm.
  • Ideal for automated placement.
  • Trench MOS Schottky technology.
  • Low power losses, high efficiency.
  • Low forward voltage drop.
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C.
  • Material categorization: For definitions of compliance please see www. vishay. com/doc?99912.

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Datasheet Details

Part number V8PAL50
Manufacturer Vishay
File Size 114.43 KB
Description Surface Mount Trench MOS Barrier Schottky Rectifier
Datasheet download datasheet V8PAL50 Datasheet

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www.vishay.com V8PAL50 Vishay General Semiconductor Surface Mount Trench MOS Barrier Schottky Rectifier TMBS® SMPATM Top View Bottom View DO-221BC (SMPA) PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM VF at IF = 8.0 A (TA = 125 °C) TJ max. Package 8.0 A 50 V 120 A 0.40 V 150 °C DO-221BC (SMPA) Diode variation Single die FEATURES • Very low profile - typical height of 0.95 mm • Ideal for automated placement • Trench MOS Schottky technology • Low power losses, high efficiency • Low forward voltage drop • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Material categorization: For definitions of compliance please see www.vishay.