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VS-GB100TH120N - Molding Type Module IGBT

Description

Vishay’s IGBT power module provides ultra low conduction loss as well as short circuit ruggedness.

It is designed for applications such as general inverters and UPS.

Features

  • Low VCE(on) SPT + IGBT technology.
  • 10 μs short circuit capability.
  • VCE(on) with positive temperature coefficient.
  • Maximum junction temperature 150 °C.
  • Low inductance case.
  • Fast and soft reverse recovery antiparallel FWD.
  • Isolated copper baseplate using DCB (Direct Copper Bonding) technology.
  • Material categorization: for definitions of compliance please see www. vishay. com/doc?99912.

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Datasheet preview – VS-GB100TH120N

Datasheet Details

Part number VS-GB100TH120N
Manufacturer Vishay
File Size 127.42 KB
Description Molding Type Module IGBT
Datasheet download datasheet VS-GB100TH120N Datasheet
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Full PDF Text Transcription

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www.vishay.com VS-GB100TH120N Vishay Semiconductors Molding Type Module IGBT, 2-in-1 Package, 1200 V and 100 A Double INT-A-PAK PRODUCT SUMMARY VCES IC at TC = 80 °C VCE(on) (typical) at IC = 100 A, 25 °C Package Circuit 1200 V 100 A 1.90 V Double INT-A-PAK Half bridge FEATURES • Low VCE(on) SPT + IGBT technology • 10 μs short circuit capability • VCE(on) with positive temperature coefficient • Maximum junction temperature 150 °C • Low inductance case • Fast and soft reverse recovery antiparallel FWD • Isolated copper baseplate using DCB (Direct Copper Bonding) technology • Material categorization: for definitions of compliance please see www.vishay.
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