GFB70N03 Description
JEDEC TO-263 molded plastic body Terminals: Leads solderable per MIL-STD-750, Method 2026 High temperature soldering guaranteed: 250°C/10 seconds at terminals Weight:.
GFB70N03 Key Features
- Advanced Trench Process Technology
- High Density Cell Design for Ultra Low On-Resistance
- Specially Designed for Low Voltage DC/DC Converters
- Fast Switching for High Efficiency
- 6 9 61
- 3.0 ±100 1
- V V nA µA A mΩ S
- 34 63 11 11 9 9 100 31 3400 618 300
- 14 14 167 62
- pF ns nC