SMF6.0A
Overview
- For surface mounted applications Low-profile package e3 Optimized for LAN protection applications Ideal for ESD protection of data lines in accordance with IEC 61000-4-2 (IEC801-2)
- Ideal for EFT protection of data lines in accordance with IEC 61000-4-4 (IEC801-4)
- IEC 61000-4-2 (ESD) 15 kV (air) 8 kV (contact)
- Low incremental surge resistance, excellent clamping capability
- 200 W peak pulse power capability with a 10/1000 µs waveform, repetition rate (duty cycle): 0.01 %
- Very fast response time
- High temperature soldering guaranteed: 260 °C/ 10 seconds at terminals
- Lead (Pb)-free component
- Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC 17249 Mechanical Data Case: JEDEC DO-219AB (SMF®) Plastic case Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity:The band denotes the cathode, which is positive with respect to the anode under normal TVS operation Mounting Position: Any Weight: approx. 15 mg Packaging Codes/Options: GS18 / 10 k per 13 " reel (8 mm tape), 50 k/box GS08 / 3 k per 7 " reel (8 mm tape), 30 k/box
