DTA123JCA
Overview
- Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
- Low profile surface mounted application in order to optimize board space.
- Low power loss, high efficiency. Features
- High current capability, low forward voltage drop.
- High surge capability. x Epitax
- iaGluPalradnrianrgDfoireoCveornvsotlrtaugcetiopnrotection. x x
- leUmltreanhtaigrhy-sNpePeNd sTwyiptcehsinAgv. ailable Built-I
- nSBiliiacsoinnegpRitaexsiiasltpolrasnar chip, metal silicon junction.
- Lead-free parts meet environmental standards of Pb-FreeMIpLa-SckTaDg-1e9i5s00av/2a2il8able RoHS
- pRrooHdSucptrofodurcpt afocrkpinacgkicnogdceodseusffuixffix”G"G” " .063(1.60) .047(1.20) Package outline SOD-123H SOT-230.146(3.7)
