Full PDF Text Transcription for SFM31L (Reference)
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SFM31L. For precise diagrams, and layout, please refer to the original PDF.
WILLAS 3.01A.0SAUSFURRAFACCEEMMOOUUNNTT SSCUHPOETRTKFYABSATRRRIEECRSTSRMIOFECDCIE--TL1RI2FS3IPE+A-R5CSP0K-A-26AC00VGK0-AEV2G0E0V S F MFM3T11HL2R0U-M+ S FTFHMPMbR3FU1r8e2e...
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CSP0K-A-26AC00VGK0-AEV2G0E0V S F MFM3T11HL2R0U-M+ S FTFHMPMbR3FU1r8e2eL0P0ro-dMuc+t Features • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to Feaotputirmeizse board space. • Low power loss, high efficiency. • High current capability, low forward voltage drop. • Batch process design, excellent power dissipation offers be•tteHrigrehvseurrsgeelecaakpaagbeilictyu.rrent and thermal resistance. • Lo•wGpuroafridlerisnugrffaocr eovmeorvuonltteadgeappprolitceacttioionni.n order to op•timUlitzrea bhoigahrd-ssppeaecd