• Part: 25Q32JWCIQ
  • Manufacturer: Winbond
  • Size: 1.84 MB
Download 25Q32JWCIQ Datasheet PDF
25Q32JWCIQ page 2
Page 2
25Q32JWCIQ page 3
Page 3

25Q32JWCIQ Description

SOIC 150/208-mil, WSON 6x5-mm, XSON 4x4-mm, USON4x3-mm ........ 5 3.4 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ............................................... 6 3.5 Ball Description TFBGA 8x6-mm......................................................................................

25Q32JWCIQ Key Features

  • 4 3. PACKAGE TYPES AND