ZXMN6A09K Datasheet | Zetex Semiconductors

Description This new generation of trench MOSFETs from Zetex utilizes a unique structure that bines the benefits of low on-resistance with fast switching speed. This makes them ideal for high efficiency, low voltage power management applications. Features - - - - .. Low on-resistance Fast switching speed Low threshold Low gate drive DPAK (T0-252) package - Applications - - - - DC-DC converters Power management functions Disconnect switches Motor control Ordering information Device ZXMN6A09KTC Reel size (inches) 13 Tape width (mm) 16 Quantity per reel 2500 G S Pinout - top view Device marking ZXMN 6A09K Issue 5 - January 2007 © Zetex Semiconductors plc 2007 .zetex. Absolute maximum ratings Parameter Drain-source voltage Gate-source voltage Continuous drain current @ VGS=10V; Tamb=25°C(b) @ VGS=10V; Tamb=70°C(b) @ VGS=10V; Tamb=25°C(a) Pulsed drain current(c) Continuous source current (body diode)(b) Pulsed source current (body diode)(c) Power dissipation at Tamb =25°C(a) Linear derating factor Power dissipation at Tamb =25°C(a) Linear derating factor Power dissipation at Tamb =25°C(a) Linear derating factor Operating and storage temperature range Tj, Tstg PD PD IDM IS ISM PD Symbol VDSS VGS ID Limit 60 ±20 12.2 9.8 7.9 43 10.8 43 4.3 34.4 10.1 80.8 2.15 17.2 -55 to +150 A A A W m W/°C W m W/°C W m W/°C °C Unit V V A Thermal resistance Parameter Junction to ambient(a) Junction to ambient(b) Junction to ambient(d) Symbol R⍜JA R⍜JA R⍜JA Limit 29 12.3 58.1 Unit °C/W °C/W °C/W NOTES: (a) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions. (b) For a device surface mounted on FR4 PCB measured at t Յ10 sec. (c) Repetitive rating 50mm x 50mm x 1.6mm FR4 PCB, D=0.02 pulse width=300␮s - pulse width limited by maximum junction temperature. (d) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air...