CPD38X Datasheet | centralsemi

PROCESS Schottky Rectifier 8 Amp Schottky Rectifier Chip PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization 72 x 72 MILS 5.9 MILS 64 x 64 MILS Al/Ni/Au - 30,000Å/4,000Å/1,500Å Ti/Ni/Au - 1,600Å/5,550Å/1,500Å GEOMETRY GROSS DIE PER 5 INCH WAFER 3,137 R1 (29-April 2010) w w w. c e n t r a l s e m i . c o m...