Texas Instruments 74AC16245
The 74AC16245 is packaged in TI’s shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area. The 54AC16245 is characterized for operation over the full military temperature range of –55°C to 125°C. The 74AC16245 is characterized for operation from –40°C to 85°C.54AC16245, 74AC16245 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCAS235A – MARCH 1990 – REVISED APRIL 1996 D Members of the Texas Instruments Widebust Family D 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers D Flow-Through Architecture Optimizes PCB Layout D Distributed VCC and GND Configuration Minimizes High-Speed Switching Noise D EPIC t (Enhanced-Performance Implanted CMOS) 1-mm Process D 500-mA Typical Latch-Up Immunity at 125°C D Package Options Include Plastic Thin Shrink Small-Outline (DGG) Package, 300-mil Shrink Small-Outline (DL) Package Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Pin Spacings description The ’AC16245 are 16-bit bus transceivers organized as dual-octal noninverting 3-state transceivers designed for asynchronous two-way communication between data buses. The control function implementation minimizes external timing requirements These devices allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending upon the logic level at the direction control (DIR) input.