Texas Instruments 74ACT16823
The 74ACT16823 is packaged in theTI shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area. The 54ACT16823 is characterized for operation over the full military temperature range of 55°C to 125°C. The 74ACT16823 is characterized for operation from –40°C to 85°C Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.54ACT16823, 74ACT16823 18-BIT BUS-INTERFACE FLIP-FLOPS WITH 3-STATE OUTPUTS SCAS160A – APRIL 1991 – REVISED APRIL 1996 D Members of the Texas Instruments Widebus Family D Inputs Are TTL-Voltage Compatible D Provide Extra Data Width Necessary for Wider Address/Data Paths or Buses With Parity D Flow-Through Architecture Optimizes PCB Layout D Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise D EPIC (Enhanced-Performance Implanted CMOS) 1-µm Process D Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings description These 18-bit flip-flops feature 3-state outputs designed specifically for driving highly-capacitive or relatively low-impedance loads. They are particularly suitable for implementing wider buffer registers, I/O ports, parity bus interfacing, and working registers. The ’ACT16823 can be used as two 9-bit flip-flops or one 18-bit flip-flop.